Question about thinset coverage
I noticed in my 2018 tcna manual that for large tile that’s not stone, it’s recommended to burn the substrate, notch the substrate, and use trowel and error method to collapse ridges and get full support.
The manual specifically says that this approach eliminates the need for back-buttering the tile (they use the terms back-parging and back-buttering interchangeably, and both terms seem to mean burning the backs).
Is burning the tile really viewed as unnecessary (or at least optional) by industry standards? The manual seems most concerned with proper coverage and thinset transfer. Does meeting those 2 criteria indicate a “good enough” bond, even without burning?
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Lou
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